Heat dissipation assembly

ABSTRACT

A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.

RELATED APPLICATIONS

This application claims priority to China Application Serial Number201610714849.4, Aug. 24, 2016, which is herein incorporated byreference.

BACKGROUND Field of Invention

The present invention relates to a heat dissipation assembly. Moreparticularly, the present invention relates to a heat dissipationassembly that has a condenser and an evaporator.

Description of Related Art

When electronic components or semiconductor components of a typicalelectronic product (or a photoelectric product) are in operation, theyusually generate a great amount of thermal energy. To prevent theelectronic components or the semiconductor components from overheatingso as to damage the electronic components or the semiconductorcomponents, a heat dissipation device is often assembled to theelectronic product or the photoelectric product to reduce the workingtemperatures of the electronic components or the semiconductorcomponents, thereby avoiding the malfunction of the electronic products.

In the case of applying a typical thermal siphon, an evaporator isdisposed on a heat source, such that the heat of the heat source may betransferred to water contained in the evaporator. After the waterabsorbs the thermal energy, the water may undergo phase transformationand evaporation into water vapor. The water vapor may be transmitted toa condenser through a gas phase conduit, where the water vapor iscondensed back to water. Subsequently, the water condensed in thecondenser may return to the evaporator through a liquid phase conduit.By way of the aforesaid heat exchange circulation, the heat source canbe cooled down.

Since a typical siphon heat dissipation device mainly utilizes theprinciple that the water vapor goes up and the liquid water drops downby gravitation, the evaporator and the condenser are usually designed inupright. In other words, the gas phase conduit is connected to the topportions of the evaporator and the condenser, and the liquid phaseconduit is connected to the bottom portions of the evaporator and thecondenser. However, it is difficult in such a configuration to reducethe height of the entire heat dissipation device. The space occupationof the heat dissipation device of the electronic product limits itsapplications. Moreover, the condenser is usually composed of many pipes,which complicate the manufacturing process of the heat dissipationdevice, and increase costs of manufacture and materials.

SUMMARY

An aspect of the present invention is to provide a heat dissipationassembly.

According to an embodiment of the present invention, a heat dissipationassembly includes a condenser, an evaporator, a vapor conduit, and aliquid conduit. The condenser has a condensing chamber therein. Two endsof the vapor conduit are respectively connected to the condenser and theevaporator. Two ends of the liquid conduit are respectively connected tothe condenser and the evaporator. A geometric center of the liquidconduit in the condensing chamber is lower than or equal to a geometriccenter of the condensing chamber.

In one embodiment of the present invention, the evaporator has anevaporating chamber, and a geometric center of the liquid conduit in theevaporating chamber is lower than or equal to a geometric center of theevaporating chamber.

In one embodiment of the present invention, the evaporating chamber hasa first portion and a second portion that communicates with the firstportion, and the first portion is located at an edge of the secondportion.

In one embodiment of the present invention, the liquid conduit has awater outlet in the evaporating chamber, and the evaporator includes aliquid working fluid. The water outlet of the liquid conduit is lowerthan a liquid level of the liquid working fluid.

In one embodiment of the present invention, the water outlet of theliquid conduit rotates along an axis of the liquid conduit.

In one embodiment of the present invention, the water outlet rotatesfrom a horizontal direction to an upward vertical direction in arotation direction.

In one embodiment of the present invention, the condenser further hastwo connected oblique surfaces therein.

In one embodiment of the present invention, the two oblique surfaces arelocated in a bottom portion of the condensing chamber.

In one embodiment of the present invention, an end of the liquid conduitin the condensing chamber is adjacent to a connection position of thetwo oblique surfaces.

In one embodiment of the present invention, an included angle isincluded between the two oblique surfaces, and is in a range from 60degrees to 179 degrees.

In one embodiment of the present invention, the liquid conduit isobliquely connected to the condenser and the evaporator.

In one embodiment of the present invention, an end of the liquid conduitconnected to the condenser is higher than or equal to an end of theliquid conduit connected to the evaporator.

In one embodiment of the present invention, an included angle isincluded between the liquid conduit and the evaporator, and is in arange from 0 degree to 60 degrees.

In one embodiment of the present invention, the condenser furtherincludes a plurality of capillary structures. The capillary structuresare located on a surface of the condenser facing the condensing chamber.

In one embodiment of the present invention, the condenser or theevaporator has heat dissipation fins.

In the aforementioned embodiment of the present invention, since thegeometric center of the liquid conduit in the condensing chamber islower than or equal to the geometric center of the condensing chamber, aworking fluid condensed in the condensing chamber may flow to the liquidconduit due to gravity, such that the liquid working fluid in thecondenser is easily gathered by the liquid conduit.

It is to be understood that both the foregoing general description andthe following detailed description are by examples, and are intended toprovide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the followingdetailed description of the embodiments, with reference made to theaccompanying drawings as follows:

FIG. 1 is a perspective view of a heat dissipation assembly according toone embodiment of the present invention;

FIG. 2 is a cross-sectional view of the heat dissipation assembly takenalong line 2-2 shown in FIG. 1;

FIG. 3 is a cross-sectional view of the heat dissipation assembly shownin FIG. 2, in which the heat dissipation assembly is in an operationstate;

FIG. 4 is a cross-sectional view of the heat dissipation assembly takenalong line 4-4 shown in FIG. 1;

FIG. 5 is a cross-sectional view of the heat dissipation assembly shownin FIG. 4, in which the heat dissipation assembly is in an operationstate;

FIG. 6 is a perspective view of a heat dissipation assembly according toanother embodiment of the present invention, in which the position ofthe cut line is the same that of FIG. 4;

FIG. 7 is a perspective view of a heat dissipation assembly according toanother embodiment of the present invention; and

FIG. 8 is a cross-sectional view of the heat dissipation assembly takenalong line 8-8 shown in FIG. 7, in which the heat dissipation assemblyis in an operation state.

DETAILED DESCRIPTION

Reference will now be made in detail to the present embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings. Wherever possible, the same reference numbers are used in thedrawings and the description to refer to the same or like parts.

FIG. 1 is a perspective view of a heat dissipation assembly 100according to one embodiment of the present invention. As shown in FIG.1, the heat dissipation assembly 100 includes a condenser 110, anevaporator 120, a vapor conduit 130, and a liquid conduit 140. Two ends132, 134 of the vapor conduit 130 are respectively connected to thecondenser 110 and the evaporator 120. Two ends 142, 144 of the liquidconduit 140 are respectively connected to the condenser 110 and theevaporator 120, and the liquid conduit 140 is spaced from the vaporconduit 130 at a distance d. In this embodiment, the top view of thecondenser 110, the evaporator 120, the vapor conduit 130, and the liquidconduit 140 is quadrilateral, but the present invention is not limitedin this regard.

When the heat dissipation assembly 100 is in operation, the evaporator120 may be disposed on a heat source, and an endothermal element may bedisposed between the evaporator 120 and the heat source. The heat of theheat source may be transmitted to liquid working fluid (e.g., water) inthe evaporator 120. After the liquid working fluid receives thermalenergy, the liquid working fluid may transform into gas working fluid(e.g., water vapor), such that the gas working fluid may be transferredto the condenser 110 through the vapor conduit 130. The condenser 110may utilize external heat dissipation element (e.g., fins) to take theheat of the gas working fluid away, such that the gas working fluid iscondensed into liquid working fluid in the condenser 110. Thereafter,the liquid working fluid condensed in the condenser 110 may return tothe evaporator 120 by utilizing the liquid conduit 140. Throughaforesaid heat exchange circulation, the heat source may be cooled.

Furthermore, the condenser 110 and the evaporator 120 may respectivelyhave heat dissipation fins 119, 128, but the present invention is notlimited in this regard. In this embodiment, the heat dissipation fins119 are disposed on two flat surfaces of the condenser 110 that arerespectively at the top and the bottom of the condenser 110, and theheat dissipation fins 128 are disposed above the evaporator 120.

In the following description, the structure of each of the elements inthe heat dissipation assembly 100 will be described.

FIG. 2 is a cross-sectional view of the heat dissipation assembly 100taken along line 2-2 shown in FIG. 1. FIG. 3 is a cross-sectional viewof the heat dissipation assembly 100 shown in FIG. 2, in which the heatdissipation assembly 100 is in an operation state. As shown in FIG. 2and FIG. 3, the condenser 110 has a condensing chamber 112 therein. Thegeometric center C1 of an end of the liquid conduit 140 in thecondensing chamber 112 is lower than or equal to the geometric center C2of the condensing chamber 112. After a gas working fluid 154 enters thecondensing chamber 112 of the condenser 110 from the air outlet 136 ofthe vapor conduit 130, the condenser 110 may utilize the heatdissipation fins 119 to take the heat of the gas working fluid 154 away,such that the gas working fluid 154 is condensed into liquid workingfluid 152 in the condensing chamber 112. Through the configuration thatthe geometric center C1 of the liquid conduit 140 is lower than or equalto the geometric center C2 of the condensing chamber 112, the liquidworking fluid 152 condensed in the condensing chamber 112 may flow tothe liquid conduit 140 due to gravity, such that the liquid workingfluid 152 in the condenser 110 is easily gathered by the liquid conduit140.

In this embodiment, the condenser 110 further has two connected obliquesurfaces 114, 116 therein, and the two oblique surfaces 114, 116 arelocated in the bottom portion of the condensing chamber 112. The liquidconduit 140 in the condensing chamber 112 is adjacent to the connectionposition P of the two oblique surfaces 114, 116. It is to be noted thatthe connection position P in the embodiment may be a point or a curvedline, and the present invention is not limited in this regard, the typepf the connection position P may be determined as deemed necessary bydesigners.

After the gas working fluid 154 is condensed into the liquid workingfluid 152 in the condensing chamber 112, since the liquid conduit 140 inthe condensing chamber 112 is adjacent to the connection position P ofthe two oblique surfaces 114, 116, the liquid working fluid 152condensed in the condensing chamber 112 may flow to the water inlet 141of the liquid conduit 140 along the two oblique surfaces 114, 116 thatare at two sides of the liquid conduit 140 due to gravity, and theconfiguration of the two oblique surfaces 114, 116 decreases the flowdead corners of the condensing chamber 112 and prevents the liquidworking fluid 152 from collecting in the bottom portion of thecondensing chamber 112 of the condenser 110, especially adjacent to thecorners of the condensing chamber 112.

For example, after the gas working fluid 154 is condensed in thecondensing chamber 112 that is at the right side of the liquid conduit140, the liquid working fluid 152 formed at the right side of the liquidconduit 140 may be guided to the liquid conduit 140 by the obliquesurface 116 that is at the right side of the liquid conduit 140 due togravity; after the gas working fluid 154 is condensed in the condensingchamber 112 that is at the left side of the liquid conduit 140, theliquid working fluid 152 formed at the left side of the liquid conduit140 may be also guided to the liquid conduit 140 by the oblique surface114 that is at the left side of the liquid conduit 140 due to gravity.

In this embodiment, an included angle θ1 is included between the twooblique surfaces 114, 116, and the included angle θ1 is in a range from60 degrees to 179 degrees, which is a convenient factor for the liquidworking fluid 152 at the two sides to flow toward the liquid conduit140. Furthermore, the length L2 of the oblique surface 116 is greaterthan the length L1 of the oblique surface 114, and the oblique surface116 having the longer length L2 is located between the vapor conduit 130and the liquid conduit 140 in the condensing chamber 112. In otherwords, a distance between the oblique surface 114 that has the shorterlength L1 and the liquid conduit 140 in the condensing chamber 112 issmaller than a distance between the oblique surface 114 that has theshorter length L1 and the vapor conduit 130 in the condensing chamber112. As a result of such configuration, before the gas working fluid 154arrives at the liquid conduit 140, most of the gas working fluid 154 maybe condensed into the liquid working fluid 152, and flows to the liquidconduit 140 along the oblique surface 116. Moreover, few of the gasworking fluid 154 may be condensed into the liquid working fluid 152 atthe left side of the liquid conduit 140, and flows to the liquid conduit140 along the oblique surface 114.

In addition, the condenser 110 may further include a plurality ofcapillary structures 118. The capillary structures 118 are located on asurface 113 of the condenser 110 facing the condensing chamber 112. Thegas working fluid 154 may be easily gathered and condensed through thecapillary structures 118, such that thermal efficiency is improved tospeed up the formation rate of the liquid working fluid 152. In thisembodiment, the capillary structures 118 are located on the surface 113of the top portion of the condenser 110, but the present invention isnot limited in this regard. The capillary structures 118 may be alsoselectively disposed on the sidewall surface of the condenser 110, theoblique surface 114, and the oblique surface 116 as deem necessary bydesigners.

FIG. 4 is a cross-sectional view of the heat dissipation assembly 100taken along line 4-4 shown in FIG. 1. FIG. 5 is a cross-sectional viewof the heat dissipation assembly 100 shown in FIG. 4, in which the heatdissipation assembly 100 is in an operation state. As shown in FIG. 4and FIG. 5, the evaporator 120 has an evaporating chamber 121, and theevaporating chamber 121 communicates with the vapor conduit 130 and theliquid conduit 140. Furthermore, the geometric center C3 of an end ofthe liquid conduit 140 in the evaporating chamber 121 is lower than orequal to the geometric center C4 of the evaporating chamber 121. Theliquid conduit 140 has a water outlet 146 in the evaporating chamber121, and the level H of the water outlet 146 of the liquid conduit 140is lower than a liquid level 153 of the liquid working fluid 152. As aresult of such a design, the evaporator 120 may utilize the adjustedlevel H of the water outlet 146 of the liquid conduit 140 to control theliquid level 153 of the liquid working fluid 152, such that a portion ofspace in the evaporating chamber 121 is reserved for the diffusion ofthe gas working fluid 154, thereby preventing the flow paths of the gasworking fluid 154 and the liquid working fluid 152 from interfering witheach other to reduce thermal efficiency.

After the liquid working fluid 152 in the evaporator 120 receivesthermal energy of a heat source, the liquid working fluid 152 maytransform into the gas working fluid 154 that can rise to the top halfof the evaporating chamber 121. Thereafter, the gas working fluid 154diffuses to enter the gas inlet 138 of the vapor conduit 130 due topressure. In other words, the top half of the evaporating chamber 121 istemporary diffusion space for the gas working fluid 154, and suchliquid-gas separating design at the upper layer and the lower layer ofthe evaporating chamber 121 can prevent the flow paths of the gasworking fluid 154 and the liquid working fluid 152 from interfering witheach other in the evaporator 120.

In addition, in this embodiment, the direction of the water outlet 146of the liquid conduit 140 is the axis direction of the liquid conduit140, as shown in the direction D1 of FIG. 1. However, the presentinvention is not limited to the direction of the water outlet 146 of theliquid conduit 140.

It is to be noted that the connection relationships of theaforementioned elements will not be repeated in the followingdescription. In the following description, other types of liquidconduits and evaporators of heat dissipation assemblies will bedescribed.

FIG. 6 is a perspective view of a heat dissipation assembly 100 aaccording to another embodiment of the present invention, in which theposition of the cut line is the same that of FIG. 4. The heatdissipation assembly 100 a includes the condenser 110 (see FIG. 1), theevaporator 120, the vapor conduit 130, and a liquid conduit 140 a. Thedifference between this embodiment and the embodiment shown in FIG. 4 isthat the water outlet 146 a of the liquid conduit 140 a rotates alongthe axis A of the liquid conduit 140 a. In this embodiment, the wateroutlet 146 a rotates from a horizontal direction D2 to an upwardvertical direction D3 in a rotation direction. For example, the wateroutlet 146 a has an opening range of 45 degrees, as shown in FIG. 6.

That is to say, the direction of the water outlet 146 a of the liquidconduit 140 a is the radial direction of the liquid conduit 140 a.Through the configuration of the water outlet 146 a of the liquidconduit 140 a shown in FIG. 6, the liquid working fluid 152 (see FIG. 5)may flow out of the liquid conduit 140 a away from and back on to aheat-source side when the liquid working fluid 152 flows into theevaporating chamber 121 from the liquid conduit 140 a, therebypreventing the liquid conduit 140 a from interfering with the newlyformed gas working fluid 154 (see FIG. 5) that may cause the liquidworking fluid 152 cannot flow to the heat-source side. For example, theliquid working fluid 152 flows out of the liquid conduit 140 a towardthe sidewall 126 of the evaporator 120. Hence, the water outlet 146 amay further prevent the flow paths of the gas working fluid 154 and theliquid working fluid 152 from interfering with each other in theevaporator 120.

FIG. 7 is a perspective view of a heat dissipation assembly 100 baccording to another embodiment of the present invention. The heatdissipation assembly 100 b includes the condenser 110, an evaporator 120a, the vapor conduit 130, and a liquid conduit 140 b. The differencebetween this embodiment and the embodiment shown in FIG. 1 is that theliquid conduit 140 b is obliquely connected to the condenser 110 and theevaporator 120 a, and the end 142 of the liquid conduit 140 b connectedto the condenser 110 is higher than the end 144 of the liquid conduit140 b connected to the evaporator 120 a. As a result, due to the heightdifference of the liquid conduit 140 b, the flow speed of the liquidworking fluid 152 (see FIG. 3) that flows into the liquid conduit 140 bfrom the condenser 110 toward the evaporator 120 a may be improved,thereby improving transferring effect. In this embodiment, an includedangle θ2 included between the liquid conduit 140 b that is between thecondenser 110 and the evaporator 120 a and a horizontal level is in arange from 0 degree to 60 degrees. In other words, the included angle θ2is included between the liquid conduit 140 b and the evaporator 120 a.

Moreover, in the embodiments shown in FIGS. 1 and 7, the vapor conduit130 is substantially horizontal, but in another embodiment, the vaporconduit 130 may be designed as the liquid conduit 140 b in an obliquearrangement. In other words, the end 132 of the vapor conduit 130connected to the condenser 110 may be higher than the end 134 of thevapor conduit 130 connected to the evaporator 120 a, such that the gasworking fluid 154 (see FIG. 3) formed in the evaporator 120 a may easilyrise into the condenser 110 through the liquid vapor conduit 130.

FIG. 8 is a cross-sectional view of the heat dissipation assembly 100taken along line 8-8 shown in FIG. 7, in which the heat dissipationassembly is in an operation state. The difference between thisembodiment and the embodiment shown in FIG. 5 is that an evaporatingchamber 121 a has a first portion 122 and a second portion 124 thatcommunicates with the first portion 122, and the first portion 122 issubstantially located at an edge of the second portion 124. Hence, thecombination of the first and second portions 122, 124 is substantiallyL-shaped, but the present invention is not limited in this regard. Thevapor conduit 130 is connected to the first portion 122 of theevaporating chamber 121 a, and the liquid conduit 140 b is connected tothe second portion 124 of the evaporating chamber 121 a. As a result,the liquid level 153 of the liquid working fluid 152 in the evaporator120 a may be controlled by the level of the liquid conduit 140 b in thesecond portion 124 of the evaporating chamber 121 a, thereby ensuringthat the liquid working fluid 152 in the evaporator 120 a isaccommodated in the second portion 124 of the evaporating chamber 121 aand does not occupy the space of the first portion 122 of theevaporating chamber 121 a, and further ensuring liquid-gas separatingeffect.

After the liquid working fluid 152 in the evaporator 120 a receivesthermal energy of a heat source, the liquid working fluid 152 maytransform into the gas working fluid 154 that can rise to the firstportion 122 of the evaporating chamber 121 a. Thereafter, the gasworking fluid 154 diffuses to enter the gas inlet 138 of the vaporconduit 130 due to pressure. In other words, the first portion 122 ofthe evaporating chamber 121 a is temporary diffusion space for the gasworking fluid 154, and can prevent the flow paths of the gas workingfluid 154 and the liquid working fluid 152 from interfering with eachother in the evaporator 120 a.

Although the present invention has been described in considerable detailwith reference to certain embodiments thereof, other embodiments arepossible. Therefore, the spirit and scope of the appended claims shouldnot be limited to the description of the embodiments contained herein.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncovers modifications and variations of this invention provided they fallwithin the scope of the following claims.

What is claimed is:
 1. A heat dissipation assembly, comprising: acondenser having a condensing chamber, a first oblique surface and asecond oblique surface therein, wherein the first oblique surface isbetween a sidewall of the condensing chamber and the second obliquesurface, and a length of the first oblique surface is shorter than alength of the second oblique surface; an evaporator; a vapor conduit,wherein a first end of the vapor conduit is connected to the condenser,and a second end of the vapor conduit is connected to the evaporator;and a liquid conduit, wherein a first end of the liquid conduit isconnected to the condenser, and a second end of the liquid conduit isconnected to the evaporator, wherein a geometric center of the liquidconduit in the condensing chamber is lower than or equal to a geometriccenter of the condensing chamber, and the second oblique surface islocated between the first end of the vapor conduit in the condensingchamber and the first end of the liquid conduit in the condensingchamber, the first end of the liquid conduit in the condensing chamberis on the second oblique surface, and a distance between the sidewall ofthe condensing chamber and a connection position of the first obliquesurface and the second oblique surface is smaller than a distancebetween the sidewall of the condensing chamber and a center point of thefirst end of the liquid conduit in the condensing chamber.
 2. The heatdissipation assembly of claim 1, wherein the evaporator has anevaporating chamber, and a geometric center of the liquid conduit in theevaporating chamber is lower than or equal to a geometric center of theevaporating chamber.
 3. The heat dissipation assembly of claim 2,wherein the evaporating chamber has a first portion and a second portionthat communicates with the first portion, and the first portion islocated at an edge of the second portion.
 4. The heat dissipationassembly of claim 2, wherein the liquid conduit has a water outlet inthe evaporating chamber, and the evaporator comprises: a liquid workingfluid, wherein the water outlet of the liquid conduit is lower than aliquid level of the liquid working fluid.
 5. The heat dissipationassembly of claim 4, wherein the water outlet of the liquid conduitrotates along an axis of the liquid conduit.
 6. The heat dissipationassembly of claim 5, wherein the water outlet rotates from a horizontaldirection to an upward vertical direction in a rotation direction. 7.The heat dissipation assembly of claim 1, wherein the first obliquesurface and the second oblique surface are located in a bottom portionof the condensing chamber.
 8. The heat dissipation assembly of claim 1,wherein the first end of the liquid conduit in the condensing chamber isadjacent to the connection position of the first oblique surface and thesecond oblique surface.
 9. The heat dissipation assembly of claim 1,wherein an included angle is included between the first oblique surfaceand the second oblique surface, and is in a range from 60 degrees to 179degrees.
 10. The heat dissipation assembly of claim 1, wherein theliquid conduit is obliquely connected to the condenser and theevaporator.
 11. The heat dissipation assembly of claim 10, wherein thefirst end of the liquid conduit connected to the condenser is higherthan or equal to the second end of the liquid conduit connected to theevaporator.
 12. The heat dissipation assembly of claim 10, wherein anincluded angle is included between the liquid conduit and theevaporator, and is in a range from 0 degree to 60 degrees.
 13. The heatdissipation assembly of claim 1, wherein the condenser furthercomprises: a plurality of capillary structures located on a surface ofthe condenser facing the condensing chamber.
 14. The heat dissipationassembly of claim 1, wherein the condenser or the evaporator has heatdissipation fins.